उत्पत्ति के प्लेस
Guangdong, China
heatsink सामग्री
कॉपर और एल्यूमिनियम
CPU Support
Intel Ice Lake and Cooper Lake Server Processor
CPU Socket
FCLGA 4189-4/5(Socket P4/P5 or P+ )
Dimensions
113.0 x 78.0 x 64.0 mm
Material
AL Base + Cu Block +AL Fin + 5HP
Thermal Grease
Shin-Etsu X23-7783D Pre-Applied
TDP
~250W (Note:Matching with the application environment &Cooling fans)